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Capabilities
    • In house Custom Design & Cad Layout
    • Fine line printing
      • Fine lines down to 3 mil (0.003 inches) in width with 3 mil spaces
    • Conductors
      • Gold & solderable gold
      • Silver,  palladium silver, &  platinum silver
      • Specialty materials for printed circuit boards etc
    • Thru-hole filling
      • Gold and Silver and various alloys
      • Holes may be coated or filled.
      • Hole diameters down to 4 mils in 10 mil thick material
      • Larger holes are required for thicker materials.
    • Dielectrics
      • Crossovers, multilayer & protective coatings
      • Capacitor dielectrics
    • Resistors
      • Less than an ohm to gig ohms per square
      • Resistors may be over-glazed if required
      • Resistance +/- 10% or Laser trimable to less than 1%
    • Capacitors
      • 1 Pf (picofarad) to greater than 1000 Pf depending on K (dielectric constant).
      • Capacitance +/- 30% or Laser trimable to +/- 5%
    • Maximum screen printable size 8” x 8”
    • Typical materials
      • Alumina 96.0% 99.5% 99.6%
      • Aluminum nitride
      • Beryllium Oxide
      • Sapphire
      • Specialty materials on a trial basis.
    • Curing capability up to 250 Deg C
    • Firing
      • Typical 850 Deg C
      • 980 Deg C available
    • Resistor Laser trimming*
    • Capacitor laser trimming*
    • Laser scribing*
    • Ceramic Laser Machining*
    • Ceramic Diamond saw Cutting*

                        * Supplied by outside services